The Summit systems are ideal for measurement of large format parts requiring high accuracy, such as solder paste stencils and screens, artwork, panelized printed circuit boards, flex circuits, and micro-etched parts.

Summit models can be equipped with an optional through-the-lens or offset mounted laser for added flexibility in Z-axis measurements. Summit models can also utilize the optional SpectraProbe™ offering sub-micron Z-axis measurement resolution.

Summit models operate with one or more of VIEW's standard metrology software packages:

• VIEW Metrology Software (VMS™)

• Elements® Electronic Measurements Software

• 	Standard	Optional
  X,Y,Z Travel	Model 625 / 615x610x150 mm Model 800 / 800x820x150 mm
  Load Capacity	Model 625 / 50 kg Model 800 / 75 kg
  Imaging Optics	Dual magnification, fixed lens optics with field interchangeable front lens. VIEW 2.5X front lens included as standard. Low mag has 1:1 with front lens; high mag has 4:1 with front lens.	Single magnification, fixed lens optics with factory configurable back tube (1X standard) and field interchangeable front lens options (5X standard).
  Metrology Camera	1.4 megapixel, 1/2 inch, digital monochrome	1.4 megapixel, 2/3 inch, digital, monochrome 2.0 megapixel 1/2 inch, digital monochrome
  Illumination	All LED coaxial through-the-lens surface light and below-the-stage back light	Multi-color programmable ring light Grid autofocus system
  Sensor Options		Through-the-lens (TTL) laser Spectra Probe white light range sensor Off-axis triangulation laser
  Measurement Modes	High Speed Move and Measure (MAM)	Continuous Image Capture (CIC)